Semiconductor Carrier Wafer Cleaning & Reclamation
JEPE provides professional precision cleaning and reclamation services for semiconductor carrier wafers. We remove temporary bonding adhesive, particles, watermarks, and process residues to help customers extend carrier lifetime while reducing replacement costs and in-house cleaning expenses.
2–14" Round Carriers | Square Carriers up to 600 mm | AOI / TTV Inspection | Lot Traceability
About JEPE
Enabling Carrier Wafer Reuse to Optimize Manufacturing Costs
JEPE specializes in advanced precision cleaning and reclamation services for carrier wafers used in semiconductor manufacturing.
In advanced packaging processes such as 2.5D/3D IC, CoWoS, FOPLP, and CoPoS, as well as wafer thinning applications, the surface cleanliness and flatness of carrier wafers can directly affect process yield and long-term device reliability.
Our goal is to provide the most appropriate carrier wafer reclamation solution for each customer's process requirements.
By combining expertise in specialty cleaning chemistry, process parameter optimization, and equipment integration, we help customers establish standardized carrier reuse and management processes.
Through close, long-term collaboration with our customers, we continuously optimize process performance while extending the service life of high-value glass and silicon carriers. This helps reduce waste, lower carbon impact, and maximize resource efficiency.
Supported Carrier Specifications
Carrier Types
Carrier Wafer, Glass Carrier, Temporary Bonding Carrier, Wafer Carrier
Materials
Glass, Silicon, Quartz, Sapphire, Silicon Carbide (SiC)
Dimensions
-
Round Carriers: Φ 2"–14"
-
Square Carriers: 300mm*300mm、310mm*310mm、510mm*515mm、600mm*600mm
Contaminants We Remove
Adhesive Residue, Particles, Oil and Organic Contamination, Watermarks, Process Residues, Metal Residues, including Au, Cu, Ti, Ag, and others
Cleaning requirements vary depending on carrier material, contamination type, and customer specifications. JEPE evaluates each sample individually and develops a cleaning process tailored to the specific application.
Carrier Wafer Cleaning Across Key Semiconductor Processes
JEPE's precision cleaning services are designed for carrier wafers used in advanced semiconductor packaging, wafer-level packaging, and backside thinning processes. We help customers thoroughly remove temporary bonding adhesive and process-generated particle contamination, enabling reliable carrier wafer reuse while supporting higher process yield.
Wafer Backside Processing & Thinning
For wafer thinning and backside processing applications, JEPE precisely removes residual temporary bonding adhesives and fine particles from carrier wafers.
The process restores carrier surface cleanliness and helps maintain the flatness required for subsequent bonding processes.
Wafer-Level Packaging
For wafer-level packaging applications, JEPE provides precision carrier wafer cleaning after redistribution layer and molding processes.
Our cleaning processes effectively remove process-induced chemical residues and polar contaminants, helping improve downstream process stability and product yield.
Advanced Packaging Carrier Reclamation
Designed specifically for advanced packaging applications, our reclamation process removes stubborn polymer residues remaining after laser debonding, enabling carrier wafers to be reused over multiple production cycles.
Why Choose JEPE?
01
Expertise in Precision Cleaning & Specialty Chemistry
JEPE has extensive experience in semiconductor and microelectronics cleaning. With in-house expertise in the development and formulation of highly selective specialty cleaning chemistries, we can evaluate different carrier wafer materials, bonding adhesives, and process contaminants to determine the optimal cleaning conditions.
02
Customized Cleaning Processes
Each carrier wafer application involves different temporary bonding adhesives, process contaminants, surface conditions, and flatness requirements.
Through systematic sample analysis and testing, JEPE develops an optimized cleaning process tailored to each customer's specific manufacturing requirements.
03
Reduce In-House Cleaning Costs
By outsourcing carrier wafer cleaning to JEPE, customers can reduce the costs associated with cleaning equipment, labor, chemical consumables, maintenance, and wastewater treatment.
This enables manufacturers to focus their internal resources on their core production processes.
04
Extend Carrier Lifetime
An optimized cleaning and reclamation process can significantly improve carrier wafer reuse rates, reduce premature scrapping, and lower the cost of purchasing new carriers.
Process Stability & Lot Management
JEPE is ISO 9001 certified and operates in accordance with stringent semiconductor manufacturing and quality management requirements. We maintain detailed process parameter records and end-to-end quality traceability throughout the cleaning process.
Our lot traceability, precision visual inspection, and clean packaging management systems are designed to minimize risks to customers' downstream processes while ensuring consistent cleaning quality.
Complete Lot Traceability
Standardized lot control procedures are implemented throughout production. For each carrier wafer lot, JEPE maintains detailed records covering incoming status, cleaning time, cleaning chemistry parameters, process conditions, and outgoing status. Our traceability system can also be aligned with customer production records to support complete end-to-end process traceability.
Wafer-Level Precision Visual Inspection
Following cleaning, carrier wafers are carefully inspected in a cleanroom environment for surface defects and residues.
This helps prevent residual contamination or foreign particles from entering the customer's production line.
Packaging & Shipping Management
Inspection Criteria Can Be Customized to Customer Requirements
Inspection items and acceptance criteria can be jointly defined according to the specific requirements of each customer's production line.
AOI: Precision detection of micron-scale adhesive residues, particles, and foreign materials on carrier surfaces.
TTV: Verification of glass or silicon carrier flatness after cleaning.
Defect Prevention: Inspection for edge chipping, scratches, microcracks, breakage, and other potential defects.
From Sample Testing to Mass Production
Step 01
Step 02
Step 03
Step 04
Step 05
Step 06
Technical Requirement Review
We evaluate the carrier wafer material, temporary bonding adhesive, primary process contaminants, and application requirements to establish clear cleanliness specifications and acceptance criteria.
Initial Cleaning Process Evaluation
The customer provides a small number of samples for evaluation.
JEPE's technical team analyzes the substrate and contamination conditions to identify suitable specialty cleaning chemistries and determine the initial cleaning process approach.
Engineering Sample Testing & Process Validation
Engineering sample tests are conducted to optimize key process parameters, including cleaning time, chemical concentration, temperature, and other relevant conditions. A comprehensive test report is provided upon completion.
Quality Inspection & Specification Confirmation
JEPE works with the customer to verify post-cleaning surface cleanliness, particle levels, and flatness to ensure that the cleaned carriers meet the requirements of subsequent manufacturing processes.
Quotation & Production Planning
Pricing is determined based on production volume, lead time, inspection requirements, and packaging specifications.
JEPE can also support customer supplier audits and coordinate requirements related to facility operations, information systems, and quality control procedures.
Mass Production & Continuous Quality Monitoring
Once the standard operating procedure has been agreed upon, the cleaning process is transferred into mass production with appropriate process monitoring and statistical process control.
Our goal is to maintain consistent cleaning quality and reliable on-time delivery throughout long-term production.
Reduce Cost and Resource Waste
Carrier wafer reclamation helps extend carrier service life, reduce scrapping, lower replacement costs, and minimize waste generation.
In addition to improving manufacturing cost efficiency, carrier reuse supports more sustainable manufacturing and a circular use of valuable resources.
Reduce Carrier Wafer Scrap
Extend Carrier Wafer Service Life
Reuse Carrier Wafers to Reduce Cost and Resource Waste
Reduce New Carrier Purchases
Optimize overall operating costs.
Cleaning Results
Heading 2
Before Cleaning
After Cleaning
Before Cleaning
After Cleaning
Cleaning Feasibility Evaluation
Please provide information regarding your carrier wafer material, dimensions, contamination conditions, estimated quantity, and cleaning objectives.
The JEPE engineering team will help evaluate the appropriate cleaning process and recommend a sample testing plan.